PTD brings powerful and easy-to-use thermal analysis to Cadence APD and Sigrity UPD (previously Synopsys Encore). Make thermal analysis a seamless part of the design process.
Why Integrate Thermal Analysis Capabilities Into ECAD?
"Today’s high-speed high pin count IC package designs demand that thermal analysis be part of the design cycle, and not just an isolated post design sign-off exercise. Our customers have been asking for a proven well integrated and user friendly solution for IC Package thermal analysis, thanks to our Connections program that solution is now available."
Keith Felton, Group Director – Product Marketing for Cadence’s Allegro IC Packaging solutions
"A number of our customers are encountering thermal related issues as a byproduct of the silicon densities of 130 and 90-nanometer design. Compounding the problem is the growing popularity of stacked die packages that layer several die on one another in a single package. Accurate thermal modeling of these scenarios is critical to successful design implementation. Synopsys customers now have the option to launch PTD 2.0 directly from our Encore design tool."
Kevin Rinebold, technical marketing manager for Synopsys
Why include thermal simulation in your package design process?
"We use PTD and find that it provides a turn-key solution for valuating package-level thermal designs using native ECAD data. The ECAD interface makes PTD very easy to use and it dramatically reduces the time required to perform a detailed package level analysis. Equally important is that our benchmark validation exercises showed simulation accuracy to be within 10% of experimental data."
Jesse Galloway senior manager in charge of Thermal Characterization at Amkor Technology
"Before PTD was developed, we knew that the thermal performance of electronic packages is affected by the changes in the details of the design. We didn't have the tools to thermally simulate them accurately so packages were treated as a black box. Now with PTD we can open these black boxes and understand how the design changes, such as traces, vias, wirebonds, and solder masks, have an effect on their thermal performance. PTD now allows Samsung to rapidly and more accurately access the thermal design of our packages."
Yunhyeok Im, Samsung, IPT Development, System LSI Division
